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diamond wire saw
产品名称

diamond wire saw

diamond wire saw also called Ultra fine wire is high carbon,cold drawing of brass plated of high strength steel wire,it can be used for cutting high hardness of monocrystalline silicon, polycrystalline silicon and quartz material etc.
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Product Details

diamond wire saw overview

diamond wire is high carbon steel wire,aslo called cutting wire or sawing wire. It's cold drawing of brass plated of high strength steel wire,can be used for cutting high hardness of monocrystalline silicon, polycrystalline silicon and quartz material etc.
Henan Hengxing Science&Technology Co.,Ltd can provide all kinds of all kinds of the length of the wire, the line length subject only to the spool take-up capacity limit. H wheel type mainly includes NTC210 type, BS200, BS64, BS126, etc. According to customer needs to provide other specification size h wheel.
 
 

advantages of diamond wire cutting

The diamond wire multi-wire slicing technology has the advantages that it is with quick speed, high machining precision, low cutting loss, high efficiency, energy saving, environment-friendly. The cutting speed of diamond wire is 3 times that of traditional slurry cutting.
It makes a revolutionary contribution to the energy conservation and cost-reducing of PV and sapphire cutting industry.
 
 
Storage requirements and matters needing attention
1. Each tray are desiccant
2. Tray vacuum packing open before, in the temperature and humidity appropriate warehouse environment can deposit 6 months
3. In the tray vacuum packing open before, please first will be placed on the tray use environment, in order to avoid temperature lead to water vapor condensation
4. Please do not bare hand touch just silk
5. In the open h wheel package preparation in the machine welding/tie wire tension when you end rubber ring, avoid to cause threading or loose ends
6. In transit please don't stack tray
  
 
Packaging and Delivery
Packaging:steel spool, carton, wooden pallet
The cargo is shipped by sea in full containers
 
Technical Parameters
 

Product Code(um)

Diameter(um)

core wire Diameter(um)

Diamond particleSize(um)

Min Circle diameter(mm)

Min Breaking Load(N

 

Particles(/mm)

 

Application

50

65±2

50

5-10

100

Min.9.5

150-300

Single crystal cutting

 

52

67±3

52

5-10

100

Min.10

150-300

55

70±3

55

5-10

100

10

150-300

 

polycrystalline Silicon Slicing cutting

57

72±3

57

6-12

100

13

150-350

60

75±3

60

6-12

100

13.5

150-350

65

80±3

65

6-12/7-14

100

15.2

150-350

70

85±3

70

7-14

100

17.2

150-350

80

95±3

80

6-12/8-12

100

20.5

150-350

145

145±10

120

8-12/8-16

130

40

Min.30

 

MagneticMaterial Cutting

180

185±10

125

30-40

130

49

Min.30

195

195±10

130

30-40

130

50

Min.30

210

210±10

150

23-35/30-40

130

60

Min.30

230

230±10

160

30-40

130

70

Min.30

 

Sapphire Cutting

240

240±10

170

30-40

130

78

Min.30

250

255±10

180

30-40

150

80

Min.30

260

260±10

180

30-40/35-45

150

83

Min.30

320

320±10

250

40-50

150

150

Min.30

Silicon Bricking and Cropping

350

350±10

300

40-50

150

200

Min.30

370

385±10

300

30-40/40-50

200

200

Min.30

420

420±10

350

40-50

200

280

Min.30

Silicon Bricking/Squaring

450

450±10

350

45-55

200

280

Min.30

 

Tag:Polycrystalline Solar Wafer   Solar silicon wafer

Sawing Wire For Solar Wafer Cutting  

 

Corresponding parameter set not found, please add it in property template of background
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暂未实现,敬请期待

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